Technology

Laser Nanodiamond Synthesis

Ray's technology of nanodiamond manufacturing consists of four main processes:
• Preparation of carbon soot from pure graphite
• Forming special targets from the carbon soot and hydrocarbons
• Laser treatment of targets in liquid
• Nanodiamond isolation by flotation and washing

Then nanodiamonds undergo a process of surface modification, which is special for each application and intended to provide the charge and the functional groups on the surface of nanodiamonds for the desired interaction with molecules of a composite material matrix.

Advantages of Ray's technology for nanodiamond synthesis (comparing to detonation nanodiamond synthesis)

• Environment-friendly and non-hazardous
• Enables to control average crystal size and defects
• Allows obtaining nanodiamonds of much higher quality:
- More pure, metal- and graphite-free
- More homogeneous, mono-crystalline only
- Controlled chemistry of nanodiamond primary particles surface area
• Wider scope of potential applications
• Higher efficiency in most applications
• Cost-effective in mass production

 

Nanodiamond Dispersions

 
Most nanodiamon applications require disaggregation of agglutinated nanocrystals and their uniform introducing within chosen material. Therefore, Ray Techniques company developed industrial processes for nanodiamond surface functionalization in order to provide desired interaction with molecules of various solvents.

The developed process of nanodiamond surface functionalization includes heating, chemical modification, ultrasonic treatment and centrifugation. This technology enable to obtain highly dispersed diamond nanocrystals in various solvents, which affects high performance of nanodiamonds in most applications. DLS analysis indicates full disaggregation of nanodiamonds in water at high concentration of 1.7 wt.%.

Nanodiamond Compounds for Diverse Applications

The company has developed highly efficient nanodiamond lubricants for antiwear treatment of friction pairs in machinery, coolants for dicing wafers, polishing pastes and gels and thermal insulating compounds for electronics.